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74LVT244 *74LVTH244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
July 1999 Revised August 1999
74LVT244 *74LVTH244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
General Description
The LVT244 and LVTH244 are octal buffers and line drivers designed to be employed as memory address drivers, clock drivers and bus oriented transmitters or receivers which provide improved PC board density. The LVTH244 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These octal buffers and line drivers are designed for lowvoltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT244 and LVTH244 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation.
Features
s Input and output interface capability to systems at 5V VCC s Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH244), also available without bushold feature (74LVT244) s Live insertion/extraction permitted s Power Up/Down high impedance provides glitch-free bus loading s Outputs source/sink -32 mA/+64 mA s Functionally compatible with the 74 series 244 s Latch-up performance exceeds 500 mA
Ordering Code:
Order Number 74LVT244WM 74LVT244SJ 74LVT244MSA 74LVT244MTC 74LVTH244WM 74LVTH244SJ 74LVTH244MSA 74LVTH244MTC Package Number M20B M20D MSA20 MTC20 M20B M20D MSA20 MTC20 Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter "X" to the ordering code.
Logic Symbol
IEEE/IEC
(c) 1999 Fairchild Semiconductor Corporation
DS500154
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74LVT244 *74LVTH244
Connection Diagram
Pin Descriptions
Pin Names OE1, OE2 Description 3-STATE Output Enable Inputs I0-I7 O0-O7 Inputs Output
Truth Tables
Inputs OE1 L L H Inputs OE2 L L H
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
Outputs In L H X (Pins 12, 14, 16, 18) L H Z Outputs In L H X (Pins 3, 5, 7, 9) L H Z
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74LVT244 *74LVTH244
Absolute Maximum Ratings(Note 1)
Symbol VCC VI VO IIK IOK IO ICC IGND TSTG Parameter Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Value -0.5 to +4.6 -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -50 -50 64 128 64 128 -65 to +150 Output in 3-STATE Output in HIGH or LOW State (Note 2) VI < GND VO < GND VO > VCC VO > VCC Output at HIGH State Output at LOW State Conditions Units V V V V mA mA mA mA mA C
Recommended Operating Conditions
Symbol VCC VI IOH IOL TA t/V Supply Voltage Input Voltage HIGH-Level Output Current LOW-Level Output Current Free-Air Operating Temperature Input Edge Rate, VIN = 0.8V-2.0V, VCC = 3.0V -40 0 Parameter Min 2.7 0 Max 3.6 5.5 -32 64 85 10 Units V V mA C ns/V
Note 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied. Note 2: IO Absolute Maximum Rating must be observed.
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74LVT244 *74LVTH244
DC Electrical Characteristics
Symbol VIK VIH VIL VOH Parameter Input Clamp Diode Voltage Input HIGH Voltage Input LOW Voltage Output HIGH Voltage VCC (V) 2.7 2.7-3.6 2.7-3.6 2.7-3.6 2.7 3.0 VOL Output LOW Voltage 2.7 2.7 3.0 3.0 3.0 II(HOLD) (Note 4) II(OD) (Note 4) II Bushold Input Over-Drive Current to Change State Input Current Control Pins Data Pins IOFF IPU/PD IOZL IOZH IOZH+ ICCH ICCL ICCZ ICCZ+ ICC Power Off Leakage Current Power up/down 3-STATE Output Current 3-STATE Output Leakage Current 3-STATE Output Leakage Current 3-STATE Output Leakage Current Power Supply Current Power Supply Current Power Supply Current Power Supply Current Increase in Power Supply Current (Note 7)
Note 3: All typical values are at VCC = 3.3V, TA = 25C. Note 4: Applies to bushold versions only (74LVTH244). Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW. Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
T A =-40C to +85C Min Typ (Note 3) -1.2 2.0 0.8 VCC-0.2 2.4 2.0 0.2 0.5 0.4 0.5 0.55 75 -75 500 -500 10 1 -5 1 100 100 -5 5 10 0.19 5 0.19 0.19 0.2 V V V V V V V V V V A A A A A A A A A A A A A mA mA mA mA mA II = -18 mA VO 0.1V or VO VCC - 0.1V IOH = -100 A IOH = -8 mA IOH = -32 mA IOL = 100 A IOL = 24 mA IOL = 16 mA IOL = 32 mA IOL = 64 mA VI = 0.8V VI = 2.0V (Note 5) (Note 6) VI = 5.5V VI = 0V or VCC VI = 0V VI = VCC 0V VI or VO 5.5V VO = 0.5V to 3.0V VI = GND or VCC VO = 0.5V VO = 3.0V VCC < VO 5.5V Outputs HIGH Outputs LOW Outputs Disabled VCC VO 5.5V, Outputs Disabled One Input at VCC - 0.6V Other Inputs at VCC or GND Max Units Conditions
Bushold Input Minimum Drive
3.0 3.0 3.6 3.6 3.6 0 0-1.5V 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6
Dynamic Switching Characteristics (Note 8)
Symbol VOLP VOLV Parameter Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL VCC (V) 3.3 3.3 TA = 25C Min Typ 0.8 -0.8 Max Units V V Conditions CL = 50 pF, RL = 500 (Note 9) (Note 9)
Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested. Note 9: Max number of outputs defined as (n). n-1 data inputs are driven 0V to 3V. Output under test held LOW.
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74LVT244 *74LVTH244
AC Electrical Characteristics
TA = -40C to +85C CL = 50 pF, RL = 500 Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ tOSHL tOSLH Output to Output Skew (Note 11) Output Disable Time Output Enable Time Propagation Delay Data to Output 1.1 1.3 1.1 1.4 1.9 1.8 VCC = 3.3V 0.3V Typ (Note 10) 3.8 3.9 4.5 4.4 4.9 4.4 1.0 1.1 1.3 1.1 1.4 1.9 1.8 4.0 4.2 5.3 5.0 5.1 4.4 1.0 ns ns ns ns Max VCC = 2.7V Min Max Units
Note 10: All typical values are at VCC = 3.3V, TA = 25C. Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design.
Capacitance (Note 12)
Symbol CIN COUT Parameter Input Capacitance Output Capacitance Conditions VCC = 0V, VI = 0V or VCC VCC = 3.0V, VO = 0V or VCC Typical 3 6 Units pF pF
Note 12: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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74LVT244 *74LVTH244
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D
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74LVT244 *74LVTH244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20
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74LVT244 *74LVTH244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 8 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com

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